EMA Expands Power IC Model Library for Cadence PSpice

Rochester, N.Y. – EMA Design Automation™ (ema-eda.com), a full-service provider of Electronic Design Automation (EDA) solutions, and AEi Systems, a world leader in power electronics modeling, analysis and design, today announced version 4.1 of the AEi Systems’ Power IC Model Library for the Cadence® PSpice® simulator with over 550 high fidelity and correlated simulation models…

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Broadcom, ShanghaiTech Partner on Wi-Fi City, IoT Innovation

Shanghai, — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced an alliance with ShanghaiTech University to bring enhanced Wi-Fi infrastructure to Shanghai and to accelerate product development for the rapidly growing Internet of Things (IoT) market. The Alliance Signing Ceremony was held at the Broadcom Asia…

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STMicro, Envivio Demo Ultra HD HEVC Tech

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Envivio (Nasdaq:ENVI), a leading provider of software-based video processing and delivery solutions, today announced that inter-operability between ST’s innovative set-top box solutions for digital home and Envivio Ultra HD HEVC (High Efficiency Video Coding) compression will be demonstrated during…

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Globalfoundries to Produce Toshiba’s FFSA Devices

Toshiba Corporation (TOKYO:6502) today announced that the company will collaborate with GLOBALFOUNDRIES in the manufacture of Toshiba’s FFSATM (Fit Fast Structured Array) products. Toshiba will expand its FFSATM business through production at GLOBALFOUNDRIES’s fabs. Initial products will be manufactured using GLOBALFOUNDRIES 65nm-LPe and 40nm-LP processes, with plans to extend the collaboration to the company’s 28nm…

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Combo Devices to Drive Inertial MEMS Sensor Growth

Lyon, France – Inertial sensors represent the largest MEMS market, accounting for more than $3.5 billion in 2012, according to Yole Développement and System Plus Consulting. A new report from the research firms finds that combination devices including accelerometer/gyroscope combos, e-compass and 9-axis sensors will drive future growth as standalone inertial devices (1- to 3-axis accelerometers,…

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Counterfeit Vulnerability: We’re All in the Same Boat

Smith & Associates recently compiled the full report of responses from this year’s annual Global Supply Chain Survey, which considers a number of core topics that shape the semiconductor and electronics industry, including: challenges and concerns, component demand trends,  counterfeit vulnerability and mitigation strategies, sustainability, influential technologies, and the role of independent distributors. Among the…

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