Sunnyvale, Calif. – AMD (NASDAQ: AMD) has joined the American Business Act on Climate Pledge in a coordination with US corporate climate leaders and the White House Office of Public Engagement. AMD along with the other participating business signatories have pledged their support for a positive, action-oriented outcome at the United Nations Climate Summit negotiations in Paris (Nov 30 –…
DetailsPortland, Ore. – Today, the Open Interconnect Consortium (OIC) announced it would be acquiring substantially all of the assets of the UPnP Forum. In exchange, OIC will offer membership to UPnP Forum members. The agreement will streamline and consolidate efforts around both organizations’ technologies and infrastructure, leading to increased alignment on standardization for the Internet of…
DetailsMouser Electronics, Inc. is now stocking the MCP9600 thermocouple EMF to temperature converter from Microchip Technology. The MCP9600 is the first thermocouple-conditioning integrated circuit to combine precision instrumentation, a precision temperature sensor and a precision, high-resolution analog-to-digital converter (ADC), in addition to a math engine preprogrammed with the firmware to support a broad range of…
DetailsSingapore — FCI, leading supplier of connectors and interconnect systems, announced an agreement with TE Connectivity* (TE), for Industrial Mini Input/Output (I/O) connector families, to establish the Industrial Mini I/O family in the market as the reliable Ethernet connector. “We are delighted having FCI as a second source for Industrial Mini I/O connectors” said Eric Leijtens,…
Details
There's positive outlook for holiday sales this year and consumers are making their purchases across multiple channels. According to Deloitte’s holiday survey, shoppers who visit stores as well as online and mobile destinations are expected to spend 75% more on holiday purchases than those who only shop in stores. Retailers are attempting to meet the…
Details
There is no easy answer to the burning question why the onshoring movement refuses to truly take off. The issue of onshoring is frequently painted in black or white. While the news media frequently writes like the return of companies to the United States from overseas is to be likened to a stampede, sceptics may…
DetailsSeoul, Korea – Samsung Electronics Co., Ltd., announced today that it is mass producing the industry’s first “through silicon via” (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company’s new TSV registered dual inline…
DetailsTokyo, Japan – TDK Corporation (“TDK”, TSE: 6762), Renesas Electronics Corporation (“Renesas Electronics”, TSE: 6723), and Renesas Semiconductor Manufacturing Co., Ltd. (“Renesas Semiconductor Manufacturing”), a wholly owned subsidiary of Renesas Electronics, today announced that they signed a basic agreement on November 27, 2015 under which Renesas Semiconductor Manufacturing’s Tsuruoka Factory will be transferred to TDK.…
DetailsAustin, Tex. — In its latest teardown report, ABI Research, a leader in technology market intelligence, discerns that the Intel® Atom™ x3 Platform, the company’s second integrated communication platform, includes the highest integration mobile platform transceiver to date. Code-named “SoFIA,” the platform series’ implemented innovation demonstrates the company’s departure from the norm in taking integration down a…
DetailsBannockburn, Ill. — IPC — Association Connecting Electronics Industries® announced today the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Modest sales growth continued in October and the book-to-bill ratio retreated to 1.02. Total North American PCB shipments increased 1.4 percent in October 2015 compared to October 2014. Year-to-date shipment growth continued…
Details