MACOM to Buy FiBest

Lowell, Mass.– M/A-COM Technology Solutions Holdings, Inc. (NASDAQ: MTSI) (MACOM), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced it has entered into a definitive agreement to acquire FiBest Limited (FiBest), a Japan-based merchant market component supplier of optical sub assemblies, in an all-cash transaction valued at approximately $60…

Details

Littelfuse Bolsters Business with TE CPD Acquisition

Littelfuse, Inc. recently announced it will acquire the circuit protection business of TE Connectivity Ltd. for $350 million in cash. The acquisition will benefit Littelfuse in several key areas. It will transform the company from a niche to leading player in polymer-based resettable circuit protection; give it entry into the Japanese market, where it has lagged…

Details

Yole: Flip Chip Investment Reboots in 2018

Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS image sensors (CIS) applications, the flip chip market is expanding. However, market research firm Yole Développement (Yole) expects flip chip capacity will max out by 2017, requiring new investment…

Details

Richardson RFPD Intros New Qorvo Power GaN on SiC HEMTs

Geneva, Ill. – Richardson RFPD, Inc. announced today the availability and full design support capabilities for three new discrete power GaN on SiC HEMTs from Qorvo. The TGF2952, TGF2953 and TGF2954 are designed using Qorvo’s proven TQGaN25 production process that features advanced field plate techniques to optimize microwave power and efficiency at high drain bias operating conditions. The HEMTs feature maximum…

Details