Lowell, Mass.– M/A-COM Technology Solutions Holdings, Inc. (NASDAQ: MTSI) (MACOM), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor products, today announced it has entered into a definitive agreement to acquire FiBest Limited (FiBest), a Japan-based merchant market component supplier of optical sub assemblies, in an all-cash transaction valued at approximately $60…
Details
The demand for smart and Internet connected devices is booming at an exponential rate. By 2016, it is estimated that there will be more than 10 billion connected devices in the world, and this number is expected to reach 25 billion by 2020, Cisco predicted. Technology companies big and small are bringing connected devices to…
DetailsOn the face of it the answer to the question in the headline above would have to be a definite yes. Many industry executives certainly believe this is the case, hence the recent spate of multi-billion dollar mergers and acquisitions. Since the beginning of 2015 there have been nearly 40 M&A deals in the semiconductor…
DetailsLittelfuse, Inc. recently announced it will acquire the circuit protection business of TE Connectivity Ltd. for $350 million in cash. The acquisition will benefit Littelfuse in several key areas. It will transform the company from a niche to leading player in polymer-based resettable circuit protection; give it entry into the Japanese market, where it has lagged…
Details
LONDON—Tsinghua Unigroup intends to spend 300 billion yuan (about $47 billion) over the next five years to build up China's position in the chip industry, according to the company chairman speaking in an interview given to Reuters. But investments and company takeovers are more likely in the United States than in Taiwan, chairman Zhao Weiguo…
Details
Due to the growth of the semiconductor business, the wider adoption of Cu pillar solutions and the introduction of flip chip technology for LED and CMOS image sensors (CIS) applications, the flip chip market is expanding. However, market research firm Yole Développement (Yole) expects flip chip capacity will max out by 2017, requiring new investment…
DetailsGeneva, Ill. – Richardson RFPD, Inc. announced today the availability and full design support capabilities for three new discrete power GaN on SiC HEMTs from Qorvo. The TGF2952, TGF2953 and TGF2954 are designed using Qorvo’s proven TQGaN25 production process that features advanced field plate techniques to optimize microwave power and efficiency at high drain bias operating conditions. The HEMTs feature maximum…
DetailsMouser Electronics, Inc. is now stocking LUXEON C Color LEDs from Lumileds. These high-power LEDs provide high candelas per lumen and luminance from a small, low-dome source to enable high brightness and precise optical control. Lumileds LUXEON C Color LEDs are available from Mouser Electronics in multiple colors as well as a full range of…
DetailsDistribution reported component sales in the Americas for Q3 CY 2015 down 0.9% compared to Q2 CY 2015.Sales for interconnect product were down 0.8% quarter on quarter, electromechanical sales down 6.6%, passive sales were up 1.2%, and semiconductor sales were down 0.3%. Display sales were up 0.3%. Book to bill for the quarter was encouraging…
DetailsBoston, Mass. – Companies with complex supply chains can be exposed to unexpected risks – or miss valuable opportunities – that stem from their dependence on natural resources, from water to land to energy. Resource scarcity, price volatility, and increased social and environmental pressure all threaten supply disruption and unplanned price spikes – but for…
Details