ASE, TDK to Form Joint Venture

Taipei, Taiwan — Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX; the “ASE”) announced that ASE will enter into a Joint Venture Agreement with TDK Corporation (TSE: 6762; the “TDK”) to establish a joint venture company (the “JV Company”) in  Taiwan which is expected to manufacture IC embedded substrates utilizing TDK’s SESUB technology.  Pursuant to the Joint…

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Hoffmann-Krippner Delivers Rugged LVDT Sensors

Frisco, Tex. – Hoffmann – Krippner Inc. now offers a wide range of rugged LVDT sensors from its German partner company INELTA for contactless and wear-free path and position detection. The LVDT sensors operate on the principle of the differential transformer and are suitable for many applications, such as medical technology, industrial, seafaring, testing, machinery…

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Tensilica Fusion DSP Uses 25% Less Energy

San Jose, Calif. – Cadence Design Systems, Inc. has introduced the new Cadence Tensilica Fusion digital signal processor (DSP) based on the Xtensa Customizable Processor. The Tensilica Fusion DSP uses 25 percent less energy, based on running a power diagnostic derived from the Sensory Truly Handsfree always-on algorithm when compared to the current low-power Cadence Tensilica…

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