Transphorm Awarded Patents for GaN Power Conversion

Goleta, Calif.– Transphorm Inc. today announced that it has secured fundamental patents in the area of Gallium Nitride (GaN) power conversion. The United States Patent and Trademark Office (USPTO) patent number 8,816,751 titled “Inductive Load Power Switching Circuits” was granted August 26, 2014 and the patent application number 13/887,204 titled “Bridge Circuits and Their Components” was allowed…

Details

Broadcom Combo Chip Doubles Wi-Fi Performance

Irvine, Calif., — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry’s most powerful 5G WiFi (802.11ac) 2×2 Multiple Input Multiple Output (MIMO) combo chip for mobile devices. The BCM4358 delivers unparalleled throughput, Bluetooth co-existence performance and indoor location accuracy, enabling OEMs to design high-end…

Details

China Capacitor Market to Reach $5.6 Billion in 2014

On the basis of dielectric material used, capacitors are categorized into ceramic, film, electrolytic, solid double layer, carbon, dielectric, and paper & plastic capacitors. Electrolytic capacitors are further classified into aluminum and tantalum electrolytic capacitors. Electronic capacitors are used in various end user applications such as Information & Communication Technology (ICT), consumer electronics, industrial, infrastructure,…

Details

Military Connector Tags to Increase by 2%

Lead times held steady for most interconnect, passive and electromechanical (IP&E) components over the past month, according to Avnet Electronics Marketing’s most recent Market and Technology Trends report. Despite slight price upticks for a few interconnect and passive components, pricing trends are expected to remain generally stable. However, tags for several types of military connectors…

Details

IPC News: Electronics Assembly Standards IPC J-STD-001 & IPC-A-610 Updated

BANNOCKBURN, Ill. — IPC, Association Connecting Electronics Industries, has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new…

Details

Ethernet Switch Market Rebounds in Q2

Redwood City, Calif.– According to a recent report by Dell’Oro Group, the trusted source for information about the telecommunications and networking industries, the Layer 2-3 Ethernet Switch market exceeded $5.6 billion in the second quarter 2014, with nearly all vendors showing strong sequential gains. “The Ethernet switch market remains robust with many strong growth engines in place for…

Details

RS Components Offers Compact Inspection Camera

Beijing — RS Components <http://china.rs-online.com/web>; (RS), the trading brand of Electrocomponents plc <http://www.electrocomponents.com/>; (LSE: ECM), the global distributor for engineers, has announced availability of a new RS branded professional-quality digital camera that enables electricians and maintenance professionals to quickly achieve high-accuracy inspections in difficult to reach locations to check equipment and cables for corrosion, leaks,…

Details

Avnet Releases PicoZed System-On-Module

Phoenix, Ariz. —Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT) today released PicoZed™, its newest family of System-On-Modules (SOMs) based on the Xilinx® Zynq®-7000 All Programmable SoC. In support of PicoZed development and prototyping, Avnet is also releasing the PicoZed Carrier Card, which provides the necessary interfaces and access to user I/O from the PicoZed…

Details