Santa Clara, Calif. – Intel Corporation (“Intel”) today announced that it has completed the acquisition of Altera Corporation (“Altera”), a leading provider of field-programmable gate array (FPGA) technology. The acquisition complements Intel’s leading-edge product portfolio and enables new classes of products in the high-growth data center and Internet of Things (IoT) market segments. “Altera is…
DetailsTaipei, Taiwan – Innodisk, the service-driven flash and DRAM module provider, introduces the industry’s first DDR4 wide temperature module series designed for industrial platforms and applications for harsh environments. Supporting the Intel Skylake H/S/U and Broadwell platform, the DDR4 wide temperature module series is JEDEC compliant and offers up to 30% higher performance with 20%…
DetailsSumitomo Chemical (“the Company”) has decided to increase the production capacity of touchscreen panels for organic LED (OLED) display panels at Dongwoo Fine-Chem Co.,Ltd., the Company’s South Korean base of operations for IT-related chemicals. The production will be raised to approximately 1.4 times the current capacity, the third expansion of the facilities. The new train…
DetailsGlobal MEMS Foundry Market: New York, N.Y. – The global MEMS foundry outsourcing market is expected to increase from $685.9 million in 2014, and reach$860.4 million in 2020, growing with a CAGR of 3.7% during 2015-2020. The global market of MEMS foundry outsourcing is mainly driven by the growth of the fabless business model segment in the MEMS industry. The…
DetailsNew Tripoli, Pa. – Strong wireless demand resulted in growth of more than 25% in Gallium Arsenide (GaAs) ICs in 2015, according to the report “The GaAs IC Market,” recently published by The Information Network, a New Tripoli, PA-based market research company. “Every cell phone contains Power Amplifiers (PA), which enables the handset to transmit voice and data…
DetailsMicrochip Technology Inc., (NASDAQ: MCHP) a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has announced that its RN2483 LoRa® module is the world’s first to pass the LoRa Alliance’s LoRaWAN™ Certification Program. The RN2483 module was independently tested by Espotel’s accredited test laboratory to meet the functional requirements of the latest LoRaWAN 1.0 protocol specification, for operation in the 868 MHz license-free…
DetailsDecember 2015 – Now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components, FCI’s new USB 3.1 Type C Connectors boast a small form factor design that is reversible for quick and easy connection whichever way it is inserted. The USB 3.1 Type C Connector is a new standard plug…
DetailsMouser Electronics, Inc. is now stocking LUXEON XR-M LED devices from Lumileds. These modular LED devices integrate three, four, or five LUXEON M LEDs on a metal core PCB, and can be connected in series or parallel, providing manufacturers with an easy-to-use solution for outdoor and industrial lighting applications. The Lumileds LUXEON XR-M modules, available…
DetailsBannockburn, Ill. — IPC — Association Connecting Electronics Industries® announced today the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Slow sales growth continued in November and bookings bounced back, but the book-to-bill ratio slipped below parity to 0.98. Total North American PCB shipments increased 0.4 percent in November 2015 compared to…
DetailsNissan Motor Co., Ltd.(HQ: Yokohama-city, Kanagawa-prefecture, Japan CEO: Carlos Ghosn), Hewlett Packard Enterprise (HQ: Palo Alto, CA U.S.A. CEO:Meg Whitman)and Siemens AG(HQ: Munich CEO: Joe Kaeser)today announced they have developed the industry’s first*1 next-generation vehicle design infrastructure that provides Nissan’s global R&D centers with a continuous, high-speed connection to the latest vehicle development data. The solution’s…
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