Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name…
DetailsRS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, today announced the signing of a global marketing partner agreement with Infineon Technologies to distribute the company’s extensive portfolio of semiconductors and other electronic components. The agreement builds upon the existing relationship between RS and Infineon and enables customers around…
DetailsWellesley, Mass. – Biometric technologies primarily are employed by the public sector, but increasingly government initiatives across the globe are mandating the use of biometric technology on an unprecedented scale; applications can be found in government, law enforcement, military, and aviation transport markets. BCC Research reveals in its new report that the steadily growing need for…
DetailsAvnet Memec – Silica, an Avnet, Inc. (NYSE: AVT) company, today announced that it has expanded its franchise portfolio to include Alliance Memory. Building on the success of their partnership with Avnet, Inc. in North America and Asia, Alliance Memory’s entire line-up of SRAMs and DRAMs is now distributed throughout the EMEA region by Avnet Memec – Silica. Alliance…
DetailsChicago, Ill. – element14 today announces three senior level appointments to strengthen its management team, following a global reorganization and strategic operational review. Dan Hill and Peter Birks have been appointed Business Presidents of Sales and Marketing and will be responsible for element14’s sales and marketing businesses in North America and Europe, respectively. Hill and Birks…
DetailsMouser Electronics, Inc. is now shipping the Intel® Celeron® Processor N3000 Series, the next-generation Intel Architecture (IA) system-on-chip (SoC) based on Intel’s 14nm process technology. Formerly known as Braswell, these 64-bit processors integrate graphics, memory controller, and I/O interfaces into a single SoC solution that balances cost, performance, and power. The Intel Celeron Processor N3000…
DetailsWith effect from 1st of November 2015, Rutronik Elektronische Bauelemente GmbH will be serving as a global distributor for Sensirion. In doing so, Rutronik is further developing its extensive sensor portfolio and supporting Sensirion in its global sales and support operations for high-quality sensors and sensor solutions. The global franchise agreement includes the Sensirion humidity…
DetailsAvnet, Inc. (NYSE: AVT), a leading global technology distributor, has announced that Ed Smith will assume a new role as senior vice president of Avnet embedded solutions globally, effective July 3, 2016. Concurrent with Avnet’s new fiscal year, Ed Smith will assume a global embedded leadership role full-time. In his new role, Smith will continue…
DetailsMouser Electronics, Inc. is now stocking the SESUB-PAN-D14580 Bluetooth® v4.1 module from TDK. This ultra-compact, Bluetooth 4.1 Low Energy (LE) micro module is the world’s smallest module for Bluetooth Smart devices. The 3.5mm × 3.5mm × 1mm SESUB-PAN-D14580 module is based on TDK’s proprietary Semiconductor Embedded in Substrate (SESUB) technology, reducing the size by 60 percent compared to modules using…
DetailsThe new report on CMOS image sensor market says Belgian nanoelectronics research center IMEC has claimed to develop a CMOS image sensor for high-performance applications like cameras, automotive and many other such applications that is based on CCD technology. The integration of CCD and CMOS is done by combining the best of both worlds i.e.,…
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