Washington — The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $27.7 billion for the month of August 2015, a decrease of 0.5 percent from the previous month when sales were $27.9 billion. Global sales from August 2015 were 3.0 percent lower than the August 2014 total of$28.6 billion. Regionally, sales…
DetailsPasadena, Calif. — Parts.io enables hardware engineers to search and compare 135M+ electronic components by category, price, availability and popularity across a global network of distributors and manufacturers. The platform offers a visual representation of complex data, enabling engineers to make the best component selection for their projects and allows users to order directly from…
DetailsTijuana, Mexico, — Flex (NASDAQ: FLEX), the sketch-to-scale solutions company that designs and builds intelligent products for a connected world, is today celebrating the grand opening of its new medical device manufacturing facility and Center of Excellence in Tijuana, Mexico, dedicated to the innovative development and manufacturing of medical devices. Located ten minutes from San Diego, California,…
DetailsAlbany, N.Y. — According to a new market report published by Transparency Market Research Head-up Display Market – Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2015 – 2022″, the global head-up displays (HUDs) market, is forecast to reach US$ 7.05 bn by 2022. A HUD is a device used to project driving-related information such as vehicle speed, fuel reading,…
DetailsWorldwide shipments of 3D printers will reach 496,475 units in 2016, up 103 percent from the predicted 244,533 units in 2015, according to Gartner, Inc.’s latest forecast. 3D printer shipments are forecast to more than double every year between 2016 and 2019, by which time worldwide shipments are expected to reach more than 5.6 million. “Rapid quality…
DetailsMellanox® Technologies, Ltd. (NASDAQ: MLNX), a leading supplier of end-to-end interconnect solutions for servers and storage systems, and EZchip (NASDAQ: EZCH; TASE: EZCH), a leader in high-performance processing solutions for carrier and data center networks, announced today that they have entered into a definitive merger agreement under which Mellanox shall acquire 100 percent of EZchip’s…
DetailsPleinfeld, Germany — As the passenger demand for quick and easy access to in-flight entertainment and connectivity (IFEC) increases, aircraft IFEC systems need to provide faster data transmission over longer distances. W. L. Gore & Associates (Gore) and Kontron – a global manufacturer of embedded computer modules, boards and systems – are working together to successfully meet these growing…
DetailsLyon, France –– Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12”eq.wafers) in 2020, supported by the wider adoption of Cu pillar technology. That growth will be led by Moore’s law pushing beyond the 28nm node and ‘More than Moore’ evolution in next generation DDR and 3DICs.…
DetailsEnglewood, Colo. – Revenue from the sale of energy-saving semiconductors for large and small transportation equipment, including rail systems, shipping, electric forklifts, mobility scooters and golf carts, grew at a compound annual growth rate (CAGR) of nearly 2 percent to reach $486 million in 2014. The market is expected to reach $525 million in 2019,…
DetailsWilmington, Del.– DuPont has named Jon D. Kemp as president of its Electronics & Communications business effective Nov. 1, succeeding David B. Miller who has elected to retire after 34 years of service to the company. Kemp will report to DuPont Executive Vice President James C. Collins, Jr. “Dave has built a distinguished career through his drive for results and his…
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