Utrecht, The Netherlands – GreenPeak Technologies, the leading low power RF semiconductor company, and Dusun Electron Ltd, a rapidly growing electronic company focusing on development of wireless internet technology and pioneering the Internet of Things (IoT) industry in China, today announced their partnership with the launch of their first Smart City assisted parking application that addresses the growing parking problems in…
DetailsNew York, N.Y. – Infor, the industry cloud company, today announced Infor Demand+, a new application designed to help simplify and accelerate supply chain forecasting processes. Infor’s next-generation demand planning application leverages a modern intuitive planning experience combined with the latest Infor technology. Infor Demand+ is designed to help provide a more comprehensive picture of future…
DetailsThe new Molex Mini50™ Unsealed Connector System is now available in Europe at TTI, Inc., a world leading specialist distributor of passive, connector, electromechanical and discrete components. Designed to meet the demand for smaller interconnects from car manufacturers, the Molex Mini50 has smaller terminals to fit more signals into vehicle interiors and delivers 50% space…
DetailsCypress Semiconductor Corp. (NASDAQ: CY) and Fujitsu Electronics Incorporated (FEI) today finalized an agreement that will significantly expand FEI’s role as a distribution partner for Cypress. In the wake of Cypress’s merger with Spansion Inc. in March 2015, the agreement replaces the two prior agreements between Spansion and FEI, providing FEI with access to the products…
DetailsPalatine, Ill. — Schneider Electric, the global specialist in energy management and automation, today announced the grand opening of its new manufacturing location in Livermore, California. The facility will serve as a West Coast hub for the U.S. Services team, offering improved customer service for Schneider Electric’s local customers while also supporting the production of Schneider…
DetailsSan Diego, Calif. — Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has introduced Qualcomm® Snapdragon Flight™, a highly optimized 58x40mm board targeted specifically for consumer drones and robotics applications. Qualcomm Snapdragon Flight is based on a Qualcomm® Snapdragon™ 801 processor, along with robust connectivity, advanced drone software and development tools, bringing cutting-edge…
DetailsSan Jose, Calif. — WPG Americas Inc. (WPGA) a subsidiary of WPG Holdings, the Global number one distributor of semiconductors, announced today it has opened a new office in Ronkonkoma, New York. The new office includes sales, marketing, operations and their Embedded Display Solutions group allowing WPGA to better serve existing and future customers in the…
DetailsRS Components (RS), the trading brand of Electrocomponents plc(LSE: ECM), the global distributor for engineers, has entered a supply agreement with B&R Enclosures, Australasia’s leading specialist in the design and manufacture of enclosures, racks and cabinets. The partnership enables customers in Australia and New Zealand to benefit from RS’ eCommerce strengths. RS is continually adding leading Australasian brands to its range for…
DetailsAlbany, N.Y. — 3D printing is a type of additive manufacturing (AM) that creates a tangible 3D object through layer-on-layer material deposition. The process, according to many, has triggered the third industrial revolution, since the technology has extensive economic and social uses. To present a comprehensive and unmatched perspective on the global 3D printing industry,…
DetailsPune, India – According to the new market research report “Smart Appliances Market by Smart Home Appliances (Washer, Dryer, Air Conditioner, Vacuum Cleaner), Smart Kitchen Appliances (Refrigerator, Dishwasher, Freezer), Technology (Wi-Fi, NFC, Bluetooth), End User, and Region – Global Forecast to 2020”, published by MarketsandMarkets, the smart appliances market is estimated to reach USD 37.2 Billion by 2020, at…
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