Future Electronics, a global leading distributor of electronic components, recently announced the NCL3008x power factor corrected primary side control LED drivers from ON Semiconductor. The new NCL3008x family of PWM controllers combines precise primary side quasi-resonant current control with active power factor correction targeting isolated flyback and non-isolated buck-boost/SEPIC constant current LED drivers. The devices…
DetailsRFMW, Ltd. announces design and sales support for the TGA3504-SM, 2 to 30GHz Gain Block from TriQuint (Qorvo). The TGA3504-SM offers 8dBm of output P1dB with a corresponding small signal gain of up to 11.5dB. Output third order intercept is >17dBm. Wideband performance of the TGA3504-SM supports multiple applications such as Electronic Warfare (EW), military…
DetailsVentec Europe continues its investment in the establishment and maintenance of meticulous aerospace-standard cleanliness in the pre-preg handling areas of their state-of-the-art distribution center in Warwickshire, United Kingdom. The European Space agency sees contamination of laminates by foreign material in the dielectric as a major problem and is collaborating with key suppliers to mitigate…
DetailsElement14 has launched the new Freescale Kinetis KL27/17 Cortex-M0+ based Freedom Platform with USB. The board is ideal for evaluating low power Cortex-M0+ based designs that require USB capability. The Kinetis KL series of MCUs is one of the most energy efficient MCUs in its class. The new Kinetis FRDM-KL27Z Cortex-M0+ based Freedom Platform with…
DetailsAmerica II Electronics, Inc., one of the world’s largest distributors of semiconductors and electronic components, today announced it has entered into a franchise distribution agreement with IQD Frequency Products, a manufacturer of frequency devices used in commercial-grade, professional-grade, and military applications. “Investments in America II’s infrastructure and supply chain are vital to our five-year growth…
DetailsIPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership. The statistical programs give participating IPC members access to global quarterly…
DetailsRaleigh, N.C. — The N.C. Department of Environment and Natural Resources today recognized the TE Connectivity Pegg Road plant in Greensboro as a 2014 Environmental Steward, one of only 21 facilities in North Carolina to earn the coveted award for a commitment to superior environmental performance. “Companies like TE Connectivity show that economic success and environmental…
DetailsRS Components (RS), the trading brands of Electrocomponents plc (LSE:ECM), the global distributor for engineers, have introduced an exciting new range of wireless modules and system-in-package devices, under an exclusive distribution agreement with Jorjin Technologies Inc. of Taiwan. The Jorjin portfolio enables RS customers to accelerate time to market and deliver competitively priced Internet of…
DetailsE2v inc has announced today the release of a stacked-package 32Mb MRAM-based product, which not only offers a significantly decreased package footprint size, but also makes it the highest density MRAM device in the industry. The EV5A16B is a stacked solution, with two 16Mb MRAM devices from Everspin Technologies and is offered in a 54…
DetailsTE Connectivity Ltd. (NYSE: TEL), a world leader in connectivity, announced today that Terrence Curtin has been appointed to the newly created position of President of TE Connectivity, reporting to Tom Lynch, TE Connectivity Chairman and CEO. In this role, Mr. Curtin will have responsibility for all of the company’s Connectivity and Sensor businesses and…
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