Seoul, South Korea — LG Electronics (LG) today announced the appointment of new executives to lead the LG Home Entertainment and LG Mobile Communications companies and the merger of its Home Appliance and Air Conditioning & Energy Solution business units to create a consolidated LG Home Appliance & Air Solution (H&A) Company. All new appointments…
DetailsFor hardware and component vendors, the Internet of Things (IoT) represents the opportunity to sell lots of parts — particularly sensors – to OEMs. But as several research firms point out, the IoT won’t do anyone much good without the ability to communicate and measure the data that’s being produced by smart machines. “IoT devices…
DetailsIPC — Association Connecting Electronics Industries® announced today the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Orders increased sharply, driving up the book-to-bill ratio, while sales remained flat. Total North American PCB shipments increased 0.8 percent in October 2014 from October 2013, bringing year-to-date shipment growth to -1.0 percent. Compared…
DetailsSan Jose, Calif. — SPS IPC Drives — Altera Corporation (NASDAQ: ALTR) today announced the availability of a functional safety development board and FPGA reference designs through NewTec, a leading European provider of safety-related electronic systems. The new board and reference designs coupled with Altera’s TUV Rheinland-qualified FPGAs, tools, and IP, enable customers to accelerate development…
DetailsRF Micro Devices, Inc. (Nasdaq: RFMD) and TriQuint Semiconductor, Inc. (Nasdaq: TQNT) today announced the two companies have received all necessary shareholder and regulatory approvals to move forward with their previously announced merger of equals and have set Wednesday, December 31, 2014, as the anticipated closing date for the transaction. Trading in the common stock…
DetailsNXP Semiconductors N.V. (Nasdaq:NXPI) today announced that it has entered into a definitive agreement with Quintic to acquire assets and IP related to its Wearable and Bluetooth Low Energy (BTLE) IC business. This transaction contributes to NXP’s drive to create security and connectivity solutions for fast-growing Internet-of-Things applications in Health & Fitness Wearables, Mobile Transactions,…
DetailsAlthough thin-film-transistor liquid crystal display (TFT LCD) technology still leads the display market, demand for the panels has been diminishing for a while. One research firm predicts the TFT LCD market will reach its peak next year while another researcher says larger-size TFT LCD displays may have some life in them yet. RnRMarketResearch.com reports the…
DetailsFairfax, Va. — InfinityQS International, Inc., the global authority on real-time quality and Manufacturing Intelligence, announces that General Cable has improved visibility and decreased process variations from plant to plant by using InfinityQS ProFicient. As a result, General Cable, a global leader in the development, manufacturing, design and distribution of aluminum, copper and fiber-optic wire and cable products,…
DetailsAustin, Tex. – Minco Technology Labs, LLC (Minco) and Northrop Grumman Corporation have signed a distribution agreement authorizing Minco to market and sell Northrop Grumman’s line of radiation hardened semiconductor products to customers in North America, Europe, and the Pacific Rim. “The Northrop Grumman name is synonymous with leading edge process and product technology and Minco…
DetailsWilmington, Mass.– Heilind Electronics, a leading distributor of electronic components, is now stocking the QSFP+ Stacked Combo/E Series interconnect system by Amphenol Connectors. The QSFP+ Stacked Combo/E Series interconnect system consists of a two-row, 38-position, 0.8 mm pitch connector and a press-fit cage designed to be compatible with the QSFP transceiver specifications. The connector system…
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