Cadence Delivers First MIPI Soundwire IP

San Jose, Calif. — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the industry’s first MIPI® SoundWireSM Controller Intellectual Property (IP). SoundWire is a new digital audio interface specification from the MIPI Alliance that enables bi-directional digital communication with a focus on low complexity and low gate count, making it…

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NKK Switches Showcases A/V Broadcast Products

Scottsdale, Ariz. (October 9, 2014) – NKK Switches, the world’s leading designer and manufacturer of innovative electromechanical switches, today outlined a suite of switch solutions to meet the needs of design engineers in the audio/video broadcast market. As the primary user interface, switches help to control the various elements of audio, video and other broadcasting…

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Digicom: How to Select an EMS Partner for Medical Device Mfg

Oakland, Calif. – Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services (EMS) company, announces that the white paper, What Medical Device Companies Need to Consider in Selecting an EMS Company, is now available on the Digicom Electronics website at www.digicom.org/selecting-ems-company.html. The article discusses the factors that contribute to a successful contract electronics manufacturing relationship and the…

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Microsemi Delivers Ultra-Secure FPGAs

Aliso Viejo, Calif.– Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new ultra secure SmartFusion2® SoC FPGAs and IGLOO2® FPGAs that have more advanced security features at the device, design and system levels than any other leading FPGA manufacturer. The new data…

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Spansion, ISSI to Develop RAM Products

Sunnyvale, Calif.– Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and Integrated Silicon Solution, Inc. (NASDAQ: ISSI), a leader in advanced memory solutions, today announced plans to develop HyperRAM™ products based on the Spansion HyperBus™ interface, which dramatically improves performance while reducing the number of pins. Both companies will have rights to sell…

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ChipMOS Q3 Revenue Up 7%

Hsinchu  — ChipMOS TECHNOLOGIES (Bermuda) LTD. (“ChipMOS” or the “Company”) (NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and testing services (“OSAT”), today reported its unaudited consolidated revenue for the month of September 2014and third quarter ended September 30, 2014. Revenue for the third quarter of 2014 was NT$5,806.3 million or US$190.7 million, representing an increase of 7.3%…

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UMC Agrees to 12” Fab Joint Venture in China

Hsinchu, Taiwan — The Board of Directors of United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today resolved to participate in a 3-way agreement for a joint venture company focused on 12″ wafer foundry services with Xiamen Municipal People’s Government and FuJian Electronics & Information Group. Based on the agreement, UMC…

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