Kontron today announced the launch of the SMARC Certified Design Partner Program, which has been set up to support customers in application-specific integration of SMARC Computer-on-Modules. Within this program, customers can make use of the entire scope of hardware integration services ranging from evaluation and development to complete system and software integration. This results in…
DetailsMouser Electronics, Inc., today announced the introduction of their updated Internet of Things (IoT) Applications site. Mouser’s new applications site provides developers with the resources they need to learn about the newest products and latest developments in this popular technology segment. The updated Internet of Things (IoT) Applications site, available on Mouser.com, contains even more…
DetailsIntel Corporation and Unity Technologies today announced a strategic collaboration to advance the development of Android*-based applications on Intel® architecture. The agreement accelerates Intel’s mobility push as millions of developers using the Unity development platform can now bring native Android games and other apps to Intel-based mobile devices. Unity adds support for Android across all…
DetailsTTI, Inc. an indirect, wholly owned subsidiary of Berkshire Hathaway, today announced the acquisition of the assets of HuaTong Electronic Co., Ltd., an electronic components distributor headquartered in Dongguan Shilong. Founded in 1994, Huatong was the first batch authorized distributor of Molex connectors in Greater China and remains the largest domestic Molex distributor in Asia…
DetailsRiverside, Calif. – Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced a specific new 4 kV ITU-T Subscriber Line Interface Circuit (SLIC) Protection Design Kit and PortNote® Solution. The design kit, PN-DESIGNKIT-47, contains a Bourns® high-surge programmable thyristor (TISP9110MDMR-S) along with ceramic PTC resettable fuses for effective protection of SLICs that must operate under 4…
DetailsCree, Inc., a leading global supplier of silicon carbide (SiC) and gallium nitride (GaN) wafers and devices, is enhancing its support of the European market by extending its partnership with APC Novacom. APC Novacom now stocks all Cree® RF devices that do not require an EU license, including GaN HEMT die, and actively supports Cree’s European market through both volume distribution and small…
DetailsTDK Corporation presents the new data book for EPCOS Ceramic Transient Voltage Suppressors (CTVS). It contains the extended product range of multilayer varistors (MLV), ESD/EMI filters, CeraDiode® components as well as leaded transient voltage/RFI suppressors of the SHCV series. Product highlights include the new automotive MLV-E series, which is qualified to AEC-Q200 and is suitable for…
Detailse2v, the leading high reliability semiconductor solutions provider, working in collaboration with Freescale in the field of semiconductor lifecycle extension, has announced the availability of a new package option for its 68020 microprocessor. This new option will facilitate the transition from the original Plastic Quad Flat Package (PQFP), discontinued in 2010, and enable manufacturers to…
DetailsSan Jose, Calif. – mCube, provider of the world’s smallest MEMS motion sensors, today announced the formation of a wholly-owned subsidiary, Ten Degrees, Inc., representing the first step towards the creation of an independent entity focused on indoor navigation. Ten Degrees has developed a core navigation engine that takes advantage of positioning information derived from the inertial-sensors available in…
DetailsON Semiconductor (Nasdaq: ONNN), driving energy efficient innovations, today announced the completion of its acquisition of Aptina Imaging. The total consideration of approximately $400 million in cash for the acquisition of Aptina Imaging was funded by cash on the balance sheet and ON Semiconductor’s existing revolving line of credit. “With a broad portfolio of products…
Details