New York, N.Y. — IEEE, the world’s largest technical professional organization dedicated to advancing technology for humanity, today unveiled the findings of a survey that revealed expert opinions about the future of driverless cars, such as speed bumps to mass adoption, essential autonomous technologies, features in the car of the future, and geographic adoption. More than…
DetailsLondon – Shipments of second-generation LTE basebands, commonly called Cat4, enabling mobile users to enjoy up to 150 Mbps bandwidth, barely exceeded 42 million in 2013. However, key chipset suppliers are stretching their muscles for next-generation basebands that will enable speeds of up to 300 Mbps, namely Cat6 chips. New findings from ABI Research indicate…
DetailsMouser Electronics, Inc. is now shipping the Intel® NUC with Intel® Atom™ processor E3815 Board and Kit. At only 7.48″x4.56″x1.57″ (190x16x40mm), this new compact computer is built on the 22nm, 1.46GHz Intel Atom processor E3815 – Intel’s 64-bit System on Chip (SoC). The NUC targets compact intelligent systems that require high performance data, graphics and media capabilities over a wide…
DetailsMountain View, Calif. – Audience, Inc. (NASDAQ: ADNC), today announced that it has completed its acquisition of Sensor Platforms, Inc. Sensor Platforms develops software and algorithms that interpret sensor data to enable broad context awareness on smartphones, wearables and other smart devices. Audience believes the combination of its Advanced Voice and Multisensory Processing with Sensor Platforms’ technology…
DetailsChicago, Ill. – Newark element14 announces an industry-leading same day ship guarantee, designed to give customers additional peace of mind as they make purchasing decisions. Under the program, Newark element14 guarantee’s the shipment of in-stock items the same day of the order or it will be expedited for free. “Our same day ship guarantee is an outstanding example…
DetailsArmonk, N.Y. — IBM (NYSE: IBM) today announced it is investing $3 billion over the next 5 years in two broad research and early stage development programs to push the limits of chip technology needed to meet the emerging demands of cloud computing and Big Data systems. These investments will push IBM’s semiconductor innovations from today’s breakthroughs into the advanced…
DetailsLyon, France – 3D Through Silicon Vias (TSV) is in MEMS, CMOS Image Sensors and high-end applications. When will it be used for mainstream consumer applications? All results are part of the new report released by Yole Développement (Yole): 3DIC & 2.5D TSV Interconnect for Advanced Packaging – 2014 Business Update. This technology & market…
DetailsBelmont, Calif. – Jameco Electronics announced today that it will give away free electronic components every Friday starting July 11. Jameco will give away a different product every week from its inventory of more than 50,000 electronic components. A limited supply of product will be made available each week at www.Jameco.com/Free. The Free Friday component of the…
DetailsBannockburn, Ill. — A new report in IPC’s series of on-shoring studies, On-Shoring in the North American Electronics Industry: Update on Trends and the Impact on Companies, has been published by IPC — Association Connecting Electronics Industries®. Presenting data collected by IPC over the past two years, the report highlights North American electronics industry trends in on-shoring and…
DetailsLaFox, Ill. – Richardson RFPD, Inc. announced today that it will globally distribute products from Maxtena, Inc., a top developer and producer for innovative wireless solutions, including GNSS, Iridium, Inmarsat and Thuraya satellites, and terrestrial M2M, MSS and LTE applications. Richardson RFPD will distribute Maxtena’s line of reliable, rugged and compact helix antennas, microstrip antennas and…
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