EMA Expands Power IC Model Library for Cadence PSpice

Rochester, N.Y. – EMA Design Automation™ (ema-eda.com), a full-service provider of Electronic Design Automation (EDA) solutions, and AEi Systems, a world leader in power electronics modeling, analysis and design, today announced version 4.1 of the AEi Systems’ Power IC Model Library for the Cadence® PSpice® simulator with over 550 high fidelity and correlated simulation models…

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Broadcom, ShanghaiTech Partner on Wi-Fi City, IoT Innovation

Shanghai, — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced an alliance with ShanghaiTech University to bring enhanced Wi-Fi infrastructure to Shanghai and to accelerate product development for the rapidly growing Internet of Things (IoT) market. The Alliance Signing Ceremony was held at the Broadcom Asia…

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STMicro, Envivio Demo Ultra HD HEVC Tech

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Envivio (Nasdaq:ENVI), a leading provider of software-based video processing and delivery solutions, today announced that inter-operability between ST’s innovative set-top box solutions for digital home and Envivio Ultra HD HEVC (High Efficiency Video Coding) compression will be demonstrated during…

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Globalfoundries to Produce Toshiba’s FFSA Devices

Toshiba Corporation (TOKYO:6502) today announced that the company will collaborate with GLOBALFOUNDRIES in the manufacture of Toshiba’s FFSATM (Fit Fast Structured Array) products. Toshiba will expand its FFSATM business through production at GLOBALFOUNDRIES’s fabs. Initial products will be manufactured using GLOBALFOUNDRIES 65nm-LPe and 40nm-LP processes, with plans to extend the collaboration to the company’s 28nm…

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HSBC: U.S. Technology Will Lead Export Growth

It might be hard to reconcile U.S. export optimism against  factors such as offshoring, but HSBC finds trade optimism among U.S. business leaders is at an all-time high. Moreover, according to HSBC analysis,  the U.S. is positioned to retain its dominance as a global technology export leader, including in industrial machinery, for the next  20…

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Huawei Lauds Spansion’s Green Efforts

Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, has been awarded Huawei Green Certification in recognition of Spansion’s ability to ensure product content and manufacturing processes meet or exceed Huawei’s stringent green requirements. The certification is given following a strict qualification process and is valid for two years. This new certification from…

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