BOMcheck is an industry collaboration led by Philips, Siemens, GE, Osram, Sony Mobile, Schneider Electric, Toshiba, Agfa, Texas Instruments and TE Connectivity to share one web database to manage supply chain compliance with the EU REACH Regulation, RoHS Directive and other regulated substances in North America, Europe and Asia Pacific. Most of these companies also…
DetailsRichardson RFPD, Inc. today announced the debut of a new publication, IN FOCUS magazine. The first issue features machine-to-machine (M2M), reflecting the Company’s extensive commitment to the M2M market. Richardson RFPD offers a broad range of M2M wireless connectivity products, from low cost embedded modules to full-function gateway solutions designed to address diverse applications, such…
DetailsTDK Corp. announces that its subsidiary, EPCOS Limited in China, has received the Excellent Service Award 2012 from Huawei Device Co. Ltd., a leading Chinese manufacturer of mobile handsets and network terminals. The award recognizes outstanding performance in the areas of customer service and on-time delivery. The EPCOS products supplied to Huawei Device include SAW…
DetailsTDK Corporation recognized Future Electronics for its outstanding sales growth in the fiscal year 2013. The company was presented with the Sales Achievement award during the EDS 2013 trade show held at The Cosmopolitan Las Vegas. The award, which was presented to Future Electronics’ top management on May 8th, recognizes the distributor’s significant sales growth…
DetailsManufacturers face a variety of challenges when it comes to their aftermarket supply chain and how to improve basic customer service. Lalit Wadhwa, senior vice president, global supply chain operations at Avnet Electronics Marketing, an operating group of Avnet, Inc. will address those issues as a keynote presenter during the upcoming Next Generation Interlog 2013 Conference. The Next Generation…
DetailsIBM (IBM) and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology. “Established over a decade ago, the IBM alliance allows the partners to leverage our combined expertise and collaborative research and innovative technology…
DetailsAvnet, Inc. a leading global technology distributor, has been honored as Business of the Year by the Chandler Chamber of Commerce. The 26th Chandler Community Awards recognized outstanding businesses and individuals from the Chandler, Arizona community. Avnet earned the Business of the Year award for its ongoing commitment to the Chandler community. “Our employees demonstrate their passion for…
DetailsGlobal electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, and American Technical Ceramics (ATC), today announced the two companies have signed a global distribution agreement. “As the needs of today’s electronics applications become more and more demanding, innovation is necessary in making components smaller, more reliable, and less expensive” “ATC is very excited…
DetailsRichardson RFPD, Inc. today announces the availability of the new Silicon Carbide (SiC) six-pack (three phase) power module from Cree, Inc. (Cree). The CCS050M12CM2 is the industry’s first commercially available SiC six-pack power module in an industry-standard 45 mm package. The new six-pack SiC 1.2 kV, 50 A module enables high performance, reliable, low cost…
DetailsAlthough market growth for service on uninterruptible power supplies (UPS) was flat in 2012, revenue in the first quarter of 2013 increased by 5 percent from the same period last year, suggesting the market may be strengthening, according to a new report from IMS Research, now part of IHS (NYSE: IHS). UPS service revenues can…
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