Molex Incorporated has launched a new application (app) that gives tablet users ready access to information on over 90 different Molex product families. Designed for Apple and Android devices, the Molex App allows tablet users to view product information, search products, view literature and view videos without being online. App users with access to an…
DetailsMouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced the 40th company anniversary milestone of Glenn Smith, Mouser’s President and Chief Executive Officer. In 1973, Pong was cutting edge in the world of video games, music came on eight-track tapes, TV viewing was limited…
DetailsAccording to DRAMeXchange, a research division of TrendForce, 1H’May NAND Flash contract prices are gradually declining due to the persistent effects of the off-peak season. Memory cards and UFDs are continuing to be affected by the seasonal slowness typical of the second quarter, as can be seen in the two products’ noticeably weak sales performances…
DetailsRS Components (RS), the trading brand of Electrocomponents plc, the world’s leading high service distributor of electronics and maintenance products, is stocking the High Density BNC (HD-BNC™) family of connectors from Amphenol, a global leader in the design, manufacture and supply of interconnect products. With a footprint 51% smaller than traditional BNC connectors, and 40%…
DetailsHarwin Inc., the leading manufacturer of hi-rel interconnect solutions and cost-saving PCB hardware products, has announced that it has presented Digi-Key Corporation with its annual award for Sales Achievement. The recognition reflects Digi-Key’s commitment to product selection, availability and service, considerable sales growth, increased stock profile and the value of their globally centralized distribution model. “Accepting this Award on behalf…
DetailsAccording to LEDinside, a research division of TrendForce, starting from August 2012, at least 5 M&A cases occurred in China and Taiwan; Epistar, for example, acquired 49% of Huga’s equity, and Sanan Opto acquired 120 million of FOREPI’s common stock. LEDinside indicated that starting from 2010, Chinese LED chip industries have aggressively invested in chips…
DetailsRichardson RFPD, Inc. today announces availability and full design support capabilities for an omni-directional heavy-duty, fully IP67 waterproof external M2M antenna from Taoglas USA, Inc. (Taoglas). The Pantheon MA760 is the first antenna on the market to combine two LTE multiple-input and multiple-output (MIMO) elements, one 2.4 GHz/5 GHz antenna and GPS in one high…
DetailsAccording to DRAMeXchange, a research division of TrendForce, given the amount of price growth experienced by PC DRAM since 4Q12, first tiered DRAM suppliers are making an increased effort to slow down their migration to Mobile DRAM. In the second quarter of this year, declines in the Mobile DRAM contract prices have eased, and price-competitive…
DetailsWPG Americas Inc. today announced a new franchise agreement with Achronix Semiconductor Corp. to distribute their line of high-density and high-performance application-targeted FPGAs. Achronix’s Speedster22i FPGAs are the industry’s most advanced FPGAs built on Intel’s ground breaking 22nm, 3-D Tri-Gate transistor technology. The Speedster22i devices have up to 1.7 million, 4-input look-up-tables and consume half…
DetailsToshiba Corp. and Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the…
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