Richardson RFPD, Inc. today announces availability and full design support capabilities for an omni-directional heavy-duty, fully IP67 waterproof external M2M antenna from Taoglas USA, Inc. (Taoglas). The Pantheon MA760 is the first antenna on the market to combine two LTE multiple-input and multiple-output (MIMO) elements, one 2.4 GHz/5 GHz antenna and GPS in one high…
DetailsAccording to DRAMeXchange, a research division of TrendForce, given the amount of price growth experienced by PC DRAM since 4Q12, first tiered DRAM suppliers are making an increased effort to slow down their migration to Mobile DRAM. In the second quarter of this year, declines in the Mobile DRAM contract prices have eased, and price-competitive…
DetailsWPG Americas Inc. today announced a new franchise agreement with Achronix Semiconductor Corp. to distribute their line of high-density and high-performance application-targeted FPGAs. Achronix’s Speedster22i FPGAs are the industry’s most advanced FPGAs built on Intel’s ground breaking 22nm, 3-D Tri-Gate transistor technology. The Speedster22i devices have up to 1.7 million, 4-input look-up-tables and consume half…
DetailsToshiba Corp. and Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced that the company has developed second generation 19 nanometer process technology that it will apply to mass production of 2-bit-per-cell 64 gigabit NAND memory chips later this month. Toshiba has used the…
DetailsSanDisk Corporation (NASDAQ: SNDK), today announced it has begun customer sampling of flash memory products based on its industry-leading 1Ynm process technology, which represents its second generation 19 nanometer (nm) manufacturing technology. SanDisk’s achievement of this breakthrough in semiconductor manufacturing takes its memory cell size from 19nm-by-26nm to 19nm-by-19.5nm, delivering a 25 percent reduction of…
DetailsMouser Electronics, Inc., a top design engineering resource and global distributor for semiconductors and electronic components, has won High Service Distributor of the Year from Kemet. The prestigious award was presented to Mouser during the Electronic Distribution Show in Las Vegas. Kemet also presented TTI with the Distributor of the Year Award for 2013 making it a clean sweep for the TTI/Mouser Team. Also…
DetailsMaxwell Technologies, Inc. announced today that it received on May 14, 2013, as anticipated, an additional notification letter from the Listing Qualifications Department of the NASDAQ Stock Market LLC (“NASDAQ”) advising the company that, due to its inability to file with the Securities and Exchange Commission its quarterly report on Form 10-Q for the period…
DetailsLittelfuse, Inc., the global leader in circuit protection, has created a NASA Exploration & Discovery Experience for the engineering community as part of its 2013 Speed2Design™ promotion. Winning design engineers will get an opportunity to go behind the scenes to spend time with NASA engineers at two premiere NASA facilities. Littelfuse will host Speed2Design TechTalk events at NASA’s Ames…
DetailsAvnet, Inc., a leading global technology distributor, today announced that Douglas Kent, global vice president of Avnet Velocity, will co-present an end-user case study with Gartner analysts Greg Aimi and Ray Barger titled, “Multi-Tier Visibility Is Now Table Stakes: Making Smart Bets on Upstream Supplier Visibility,” at the Gartner Supply Chain Executive Summit. The summit will be held at the…
DetailsTTI, Inc. Vice President Total Quality, Kevin Sink, is slated to speak at the SMTA/CALCE Electronic Parts and Supply Chain Counterfeit Symposium June 25-27, 2013, in College Park, Maryland on the University of Maryland campus. Recognized as an industry thought leader on this important hot button issue, Sink will present “A Workable Counterfeit Risk Mitigation…
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