ECIA announces Bill Bradford will assume the President and CEO position, transitioning in Q1 2018 as John Denslinger steps down. Bill Bradford has over 30 years of experience in the electronic components industry, having led the global sales organizations for Freescale, ON Semiconductor and Entropic Communications. He also served as President and CEO of Minco…
DetailsMolex announced today it has teamed up with BlackBerry Limited (NYSE: BB; TSX: BB) on the development of a 10 Gbps Ethernet Automotive Networking platform designed to increase data bandwidth in intelligent connected vehicles. Integrating very reliable high-speed data transmission, prioritization, scalability, and BlackBerry’s advanced embedded security solutions, the new Molex network platform will be officially unveiled at…
DetailsAlliance Memory today announced that it has expanded the industry’s widest offering of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs with new 512Mb x8 and x16 devices in the 78-ball and 96-ball FBGA packages, respectively. Featuring a DDR architecture, the SDRAMs provide extremely fast transfer rates of 1600Mbps and clock rates of 800MHz. “Very few…
DetailsXilinx, Inc. (NASDAQ: XLNX) today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018. Peng will become the fourth CEO in Xilinx’s history and takes the helm of the global market leader of programmable semiconductor products at a time of increasing momentum and opportunity. “Victor is unique in…
DetailsAVX Corporation (NYSE: AVX) today announced that it has signed a definitive agreement to acquire Ethertronics Inc., a privately held manufacturer of passive and active antenna systems. Ethertronics is a leader in advanced antenna system technology and manufactures antenna products for wireless applications such as mobile phones, Wi-Fi, defense, aerospace, medical, and Internet of Things.…
DetailsDENSO Corporation, one of the world’s largest automotive suppliers, and FLOSFIA Inc., a tech startup spun from Kyoto University, are partnering to develop a next-generation power semiconductor device expected to reduce the energy loss, cost, size and weight of inverters used in electrified vehicles (EVs). Through the joint development project, the two companies aim to improve the…
DetailsSMC Diode Solutions, a global leader in the design, manufacturing and marketing of discrete semiconductors, voltage regulators, and die and wafer devices, today announced a global distribution agreement with Avnet USI, a business region of Avnet, Inc. (NYSE: AVT) and world leader in Hi-Rel/MILSPEC and space level components. Under the terms of the agreement, Avnet ASI will market, sell, and…
DetailsFrom the Internet of Things to the cloud to artificial intelligence, industries are seeing a new wave of technologies that have the potential to transform and significantly impact the world around us. For its latest white paper, business information provider IHS Markit (Nasdaq: INFO) surveyed its leading technology experts to find out how these technologies are coming together…
DetailsStadium Group, a leading provider of design-led connectivity solutions, power products, human machine interface and electronic assemblies, has signed a global distribution agreement with Mouser Electronics, a leading distributor of semiconductors and electronic components. The deal covers the distribution of Stadium’s standard technology products, including power supplies, HMI modules such as single illuminated capacitive switches, and wireless IoT devices.…
DetailsThe Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $37.7 billion for the month of November 2017, an increase of 21.5 percent compared to the November 2016 total of $31.0 billion and 1.6 percent more than the October 2017 total of $37.1 billion. All major regional markets posted both year-to-year and month-to-month sales…
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