Qualcomm Incorporated (NASDAQ: QCOM) (“Qualcomm” or the “Company”) today announced that its Board of Directors unanimously rejected the unsolicited proposal announced by Broadcom Limited (“Broadcom”) on November 6, 2017. “It is the Board’s unanimous belief that Broadcom’s proposal significantly undervalues Qualcomm relative to the Company’s leadership position in mobile technology and our future growth prospects,” said Paul…
Detailsams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, and Ningbo Sunny Opotech Co., Ltd., a subsidiary of Sunny Optical Technology (Group) Company Ltd. (HKG: 02382.HK), a leading manufacturer of integrated optical devices and optical imaging system solution provider, today announced a collaboration to jointly develop and market 3D sensing camera solutions for mobile…
DetailsTTI, Inc., a world leading specialist distributor of electronic components, has signed a European agreement with Sensata Industrial Solutions, a division of Sensata Technologies which has a diverse product portfolio that includes pressure and temperature sensors and switches, position sensors, and solid state relays. Sensata Industrial Solutions encompasses well-known brands including Crydom, BEI Sensors and Kavlico,…
DetailsSager Electronics, a leading North American distributor of Interconnect, Power and Electromechanical components and provider of value-add solutions, is now stocking TE Connectivity’s Power Triple Lock connector system. TE’s Power Triple Lock connector system offers high performance with a functional design. From the audible lock to the many added customer benefits, the Power Triple Lock connector…
DetailsmCube, provider of the world’s smallest and lowest power MEMS motion sensors, today announced that it has completed the acquisition of 3D motion tracking products and technology company Xsens from ON Semiconductor. This merger brings together two complimentary innovators and technology leaders in the 3D motion sensing and tracking industry: Privately held mCube is the…
DetailsIPC — Association Connecting Electronics Industries® has released the G revisions of the two most widely used standards in the electronic industry, IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These two documents are on a three-year renewal cycle, keeping pace with the ever changing technology within the electronics industry. The dedicated committee volunteers…
DetailsTechnology companies Osram and Continental today announced their intention to establish a joint venture. The idea is to combine innovative lighting technology with electronics and software to develop, manufacture and market intelligent lighting solutions for the automotive industry. The global joint venture will operate under the name Osram Continental GmbH and have its registered office…
DetailsMitsubishi Electric US, Inc. announced today it will acquire the power device distribution business of Powerex, Inc., a joint venture of Japan-based Mitsubishi Electric Corporation and General Electric Company. Powerex, headquartered in Youngwood, Pennsylvania, manufactures and supplies power semiconductor devices. The new business unit will operate as a division of Mitsubishi Electric US to service the North and…
DetailsMocana, the leading provider of IoT security solutions for industrial control systems (ICS) and the Internet of Things (IoT), announced a partnership with Avnet, Xilinx, Infineon Technologies and Microsoft to introduce an integrated, high-assurance industrial IoT system that meets the latest cybersecurity standards. The system is comprised of advanced hardware and software built on the…
DetailsNew Yorker Electronics has announced the release of a new development in aluminum electrolytic technology from Cornell Dubilier Electronics (CDE). The new CDE 85°C THA Series ThinPack capacitors are only 8.2mm thick, and only 9mm in the 105°C THAS Series. Comparable in height to V-chip electrolytics, tantalums and board-mounted axials, the THA and THAS offer…
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