Samsung 128GB DDR4 Modules Available in Volume

Seoul, Korea – Samsung Electronics Co., Ltd., announced today that it is mass producing the industry’s first “through silicon via” (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company’s new TSV registered dual inline…