Samsung Capital Expenditure for DRAM and NAND

Will Samsung Dash China’s Memory Market Hopes?

Is Samsung’s massive $26 billion semiconductor capex only delaying China’s push into the memory device market? While it’s not likely to halt China’s inevitable drive into the DRAM and NAND flash markets despite technology challenges, it may wield a bigger influence on its competitors’ capex plans as Samsung protects its leadership position. For buyers, it…

Western Digital Claims First 64-Layer 3D NAND

Irvine, Calif. — Western Digital Corp. (NASDAQ: WDC) today announced that it has successfully developed its next generation 3D NAND technology, BiCS3, with 64 layers of vertical storage capability. Pilot production of the new technology has commenced in the Yokkaichi, Japan joint venture facilities and initial output is expected later this year. Western Digital expects…

Spansion, XMC to Jointly Develop 3D NAND

Sunnyvale, Calif. — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and XMC, China’s fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements. According to TechNavio, 3D NAND is expected to grow at a…