Innodisk Releases DDR4 Industrial Modules

Taipei, Taiwan – Innodisk, the service-driven flash and DRAM module provider, introduces the industry’s first DDR4 wide temperature module series designed for industrial platforms and applications for harsh environments. Supporting the Intel Skylake H/S/U and Broadwell platform, the DDR4 wide temperature module series is JEDEC compliant and offers up to 30% higher performance with 20%…

Samsung Mass Produces First 3D TSV DDR4 Modules

Seoul, Korea – Samsung Electronics, Ltd. announced today that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise…