Samsung 128GB DDR4 Modules Available in Volume

Seoul, Korea – Samsung Electronics Co., Ltd., announced today that it is mass producing the industry’s first “through silicon via” (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company’s new TSV registered dual inline…

Samsung to Mass Produce First 8-Gb DDR4 on 20-NM

Seoul, Korea – Samsung Electronics Co., Ltd., the world leader in memory technology, today announced that it is mass producing the industry’s most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers. “Our new 20nm 8Gb DDR4 DRAM more than meets the high performance, high density and energy…

Samsung Mass Produces First 3D TSV DDR4 Modules

Seoul, Korea – Samsung Electronics, Ltd. announced today that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise…