X-FAB to Acquire Assets of Altis Semiconductor

X-FAB Silicon Foundries has today announced that it will acquire the assets of Altis Semiconductor, a specialty stand-alone foundry located in the Greater Paris area, out of insolvency proceedings. With both companies serving complementary markets and applications, this acquisition enriches X-FAB’s offering. It roughly doubles the company’s 8-inch capacity to meet the growing demand for…

SMIC Shenzhen Fab Begins Operation

Shanghai — Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981), the largest and most advanced pure-play foundry provider in China, announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line…

UMC Starts Volume Production for Lantiq PMICs

Hsinchu, Taiwan — United Microelectronics Corporation (NYSE: UMC; TSE: 2303) (“UMC”), a leading global semiconductor foundry, and Lantiq, a leading supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications. The SPT170 offers the industry’s highest breakdown…

UMC Agrees to 12” Fab Joint Venture in China

Hsinchu, Taiwan — The Board of Directors of United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today resolved to participate in a 3-way agreement for a joint venture company focused on 12″ wafer foundry services with Xiamen Municipal People’s Government and FuJian Electronics & Information Group. Based on the agreement, UMC…

TSMC Launches Ultra-Low-Power Platform for IoT

Hsinchu, Taiwan, R.O.C. — TSMC (TWSE: 2330, NYSE: TSM) today announced the foundry segment’s first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications. In this platform,…

TSMC 28HPC Process in Volume Production

Hsinchu, Taiwan — TSMC today announced its 28-nanometer High Performance Compact (28HPC) process is in volume production, making it the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment. The achievement of this milestone demonstrates TSMC’s commitment to providing industry-leading technology for customers looking to tap power and performance benefits in cost-effective SoC…

Fab Capacity Stretched: Uptick in Sight?

For an industry that’s been in the doldrums since the 2009 recession, the words “strained capacity at chip players across the industry” are, ironically, welcome. The electronics components market has enjoyed an extended period of ample supply, and only a shortage or an unexpected surge in demand will spur the market into proactive purchasing for…