Technology companies Osram and Continental today announced their intention to establish a joint venture. The idea is to combine innovative lighting technology with electronics and software to develop, manufacture and market intelligent lighting solutions for the automotive industry. The global joint venture will operate under the name Osram Continental GmbH and have its registered office…
Mitsubishi Electric US, Inc. announced today it will acquire the power device distribution business of Powerex, Inc., a joint venture of Japan-based Mitsubishi Electric Corporation and General Electric Company. Powerex, headquartered in Youngwood, Pennsylvania, manufactures and supplies power semiconductor devices. The new business unit will operate as a division of Mitsubishi Electric US to service the North and…
Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and…
ChipMOS TECHNOLOGIES INC. (listed on the Taiwan Stock Exchange under Stock Ticker 8150 and on the NASDAQ under Stock Ticker IMOS; hereinafter “ChipMOS Taiwan” or “ChipMOS”) and Tsinghua Unigroup Ltd. (“Tsinghua Unigroup”) today announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup’s earlier private placement plan. Under the joint-venture agreement, ChipMOS TECHNOLOGIES (BVI)…
Alpharetta, Ga. – Hoffmann + Krippner, Inc. is proud to announce that TES Frontdesign has engaged in a joint venture with Hoffmann + Krippner as their new majority owner. This enables HK to provide a wider array of sensing & input products and technologies to US and Canada based electronics developers and manufacturers. In addition, this…
Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name…
Western Digital® Corp. (NASDAQ: WDC) and Unisplendour Corporation Limited (Unis) (SZSE: 000938) today announced an agreement to form a joint venture to market and sell Western Digital’s current data center storage systems in China and to develop data center storage solutions for the Chinese market in the future. The joint venture will be owned 51% by Unis…
Shanghai — Johnson Controls has signed a memorandum of understanding (MOU) with Beijing Hainachuan Automotive Parts Co. Ltd. (BHAP), an auto parts subsidiary of Beijing Automotive Industry Group Co., Ltd. (BAIC Group), to set up automotive battery sales and manufacturing joint ventures in the world’s largest vehicle market. Under the MOU Johnson Controls and BHAP…
Aguascalientes, Mexico — Aguascalientes plant to build next-generation premium compact vehicles for the brands Mercedes-Benz and Infiniti Production of Infiniti vehicles to begin in 2017 Production of Mercedes-Benz vehicles to begin in 2018 Daimler and the Renault-Nissan Alliance today broke ground for their joint-venture manufacturing complex, COMPAS (Cooperation Manufacturing Plant Aguascalientes), in Aguascalientes in central Mexico, which will build…
Taipei, Taiwan — Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX; the “ASE”) announced that ASE will enter into a Joint Venture Agreement with TDK Corporation (TSE: 6762; the “TDK”) to establish a joint venture company (the “JV Company”) in Taiwan which is expected to manufacture IC embedded substrates utilizing TDK’s SESUB technology. Pursuant to the Joint…