Toshiba Develops Stacked NAND Flash with TSV
Tokyo, Japan – Toshiba Corporation claims the development of the industry’s first 16-die (max.) stacked NAND flash memory using Through Silicon Via (TSV) technology. The prototype uses TSV technology that uses the vertical electrodes and vias to pass through the silicon dies for the connection. “This enables high speed data input and output, and reduces power consumption,” said…