Toshiba Develops Stacked NAND Flash with TSV

Tokyo, Japan – Toshiba Corporation claims the development of the industry’s first 16-die (max.) stacked NAND flash memory using Through Silicon Via (TSV) technology. The prototype uses TSV technology that uses the vertical electrodes and vias to pass through the silicon dies for the connection. “This enables high speed data input and output, and reduces power consumption,” said…

NAND Flash Market Expands; Prices Decline

The global NAND flash market is growing at a CAGR of 10.1 percent to 2019, with market revenue expected to top $49 billion by 2019, according to the research report Global NAND Flash Market 2015-2019. At the same time, lower materials and manufacturing costs are helping manufacturers decrease NAND-flash ASPs. NAND flash-based storage devices are now considered…

Is NAND Flash in Limbo? Channel Pricing and Corporate Strategies

The more things change, the more they stay the same. Such is one version of the current tale in the NAND flash market as seasonally weak demand hangs on and prices limp along. Given how impressive 2014 was for a good chunk of the global semiconductor and electronics supply chain, it’s a good time to check midstream channel…

Tight Supply Continues for DDR3 SDRAM

DDR3 SDRAM continues to be the bellwether of the memory market. Despite fluctuations in pricing, product continues to be scarce and lead times continue to be an issue. Lead times for DDR3 memory ranges from 12 to 16 weeks with inventory levels remaining tight. Forecasts are pushing lead times to early 2015 for deliveries. Within…