DARPA, security, chip, design

DARPA Effort Embeds Security Into Chip Designs

The latest in a series of Pentagon semiconductor initiatives seeks to embed security features into chip designs that would allow silicon architects to probe economics-versus-security tradeoffs while baking in security throughout device lifecycles. The chip design effort represents continuing U.S. efforts to secure its electronics supply chain as semiconductors emerge as a choke point in…

Minco, Northrop Grumman Ink Distribution Deal

Austin, Tex. – Minco Technology Labs, LLC (Minco) and Northrop Grumman Corporation have signed a distribution agreement authorizing Minco to market and sell Northrop Grumman’s line of radiation hardened semiconductor products to customers in North America, Europe, and the Pacific Rim. “The Northrop Grumman name is synonymous with leading edge process and product technology and Minco…

Northrop Grumman Breaks Ground on New Facility

Linthicum, Md., — Northrop Grumman Corporation (NYSE: NOC) officially broke ground on a new $20 million Maryland Space Assembly and Test (M-SAT) facility on the back of its Baltimore campus adjacent to Baltimore Washington International Thurgood Marshall Airport. In attendance at the groundbreaking event were U.S. Sen. Ben Cardin and U.S. Reps. C. A. Dutch Ruppersberger and John Sarbanes. The event was hosted by Gloria…

TTI Receives Recognition from Northrop Grumman

TTI, Inc., the leading global distributor of passive, interconnect, electromechanical and discrete components, has received special award recognition from Northrop Grumman Aerospace Systems Division as a 2012 Platinum Source Preferred award winner. This award acknowledgement is a first-time win for TTI. These awards from Northrop Grumman recognize suppliers for achieving distinction in product quality, on-time…