Lenovo, Compal Form Joint Venture

HEFEI, China — Lenovo (HKSE: 992) (ADR: LNVGY) and Compal Electronics, Inc. today announced an agreement to form a joint venture company that will build and operate a new manufacturing center in Hefei, China. In combining with Compal, one of the world’s leading original design manufacturers (ODMs), Lenovo will add production capacity needed to sustain…

Gem, Mitsubishi Form Joint Venture

HEFEI, China, and SHANGHAI, China — GEM Services today announced that it is establishing a joint-venture company with Mitsubishi Electric Corporation (TOKYO: 6503) to manufacture energy-saving power semiconductor modules in China. The new company, Mitsubishi Electric GEM Power Device (Hefei) Co., Ltd., will begin operations in January 2012. Located in Hefei Economic & Technological Development…

Arrow, Nu Horizons Removed From Cypress Complaint

SAN JOSE, Calif. — Cypress Semiconductor Corp. (NASDAQ:CY) today announced that Arrow Electronics, Inc. and Nu Horizons Electronics Corp. executed an agreement that will remove Arrow and Nu Horizons from Cypress’s complaint to the United States International Trade Commission (ITC) regarding alleged infringement of Cypress’s SRAM patents by GSI Technology, Inc. Cypress’s complaint seeks an…

Sanmina, Kaiam Join Forces on Components

SAN JOSE and NEWARK, Calif. — Sanmina-SCI Corporation (Nasdaq: SANM), a leading manufacturing solutions company making some of the world's most complex and valuable optical, electronic and mechanical products, and Kaiam Corporation, a global manufacturer of high performance hybrid photonic integrated circuits (PICs), today announced a partnership to produce a family of optical components using…

Qualcomm Buying Assets from IDT

SAN DIEGO and SAN JOSE, Calif. — Integrated Device Technology, Inc. (IDT®; NASDAQ: IDTI) and Qualcomm Incorporated (NASDAQ: QCOM) today announced the signing of a definitive agreement to transfer the design team of IDT's Hollywood Quality Video™ (HQV™) and Frame Rate Conversion (FRC) Video Processing product lines and certain related assets to Qualcomm. In addition,…

Next-Gen IP Protection: A Jobs Plan

President Obama is slated to release a plan this week to stimulate the country’s job growth. It’s difficult to speculate just how successful this program will be, but I have my own suggestion for job creation in the high-tech sector: Get serious, and I mean really serious, about combating intellectual property theft. What does IP…

ULIS, CEA/Leti Form R&D Project

VEUREY-VOROIZE, France — ULIS, a manufacturer of high-quality infrared imaging sensors for thermography, security, automotive and military applications announced today that the company will collaborate with CEA/Leti, a leading international technology research centre, in a project to develop and market a new line of infrared (IR) sensors. Budgeted at EUR 26m, the R&D project will…

Bosch, Freescale Team Up on Chipsets

BANGALORE, India, and REUTLINGEN, Germany — Freescale Semiconductor (NYSE: FSL) and the Bosch Group’s Automotive Electronics division have combined their leading positions in automotive electronics and systems expertise to create an automotive airbag reference platform for the growing automotive safety segment in emerging markets such as India and China. The new airbag reference platform is…

OLED Technology Gets a Boost in Samsung-Universal Deal

Organic light emitting diode (OLED) display technology got a boost today as leading display manufacturer Samsung Mobile Display Co. Ltd. licensed OLED technology from Universal Display Corp. Universal is an early researcher and developer of OLED technology and materials. The companies have already worked together for more than a decade, and today's agreement will accelerate…