North America-based manufacturers of semiconductor equipment posted $2.12 billion in billings worldwide in November 2019 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.9 percent higher than the final October 2019 level of $2.08 billion, and is 9.1 percent higher than the…
The market for chipmaking equipment is likely to recover next year, energized by China increasing its spending on production gear for memory ICs and other new projects. If China buys as much equipment as anticipated, it will become the world’s largest buyer of fab tools for the first time ever, according to industry organization SEMI.…
The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion. High chip demand, strong pricing for memory, and fierce competition are driving the high-level of fab investments, with many companies investing at previously unseen levels for new fab construction and fab equipment. See…
SEMI today announced the appointment of Masahiko (Jim) Hamajima as president of SEMI Japan. Reporting to SEMI president and CEO Ajit Manocha, Hamajima assumes profit and loss (P&L) responsibility for SEMI Japan and leadership of SEMICON Japan along with all regional programs, events, and initiatives including SEMI Standards and industry advocacy. With more than 325 members, SEMI Japan plays a…
Today, SEMI, the global industry association representing the electronics manufacturing supply chain, released its Year-end Forecast at the annual SEMICON Japan exposition. SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 35.6 percent to US$55.9 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the previous market high of US$47.7…
Players in the electronic components industry agree that sales have increased steadily in the first half of 2017. Strong demand across all sectors, particularly industrial automation and automotive, has led to increased lead times across several component segments. ECIA’s latest North American distribution report for the first half of 2017 indicates that lead times for…
SEMI projects that the worldwide semiconductor equipment market will be flat this year and will rebound in 2017 according to the mid-year edition of the SEMI® Capital Equipment Forecast, released today at the SEMICON West exposition. SEMI forecasts that the total semiconductor equipment market will grow 1 percent in 2016 (reaching $36.9 billion) after contracting 3 percent in…
Pittsburgh, Pa. – MEMS & Sensors Industry Group® (MSIG) invites attendees to a special half-day workshop on the convergence of MicroElectroMechanical Systems (MEMS) devices, sensors, flexible substrates and semiconductors in the Internet of Things (IoT) at SEMICON West on July 13, 2016. Speakers will explore the theme “From Collision to Convergence: Co-Creating Solutions in the Semiconductor and MEMS/Sensors Industry” as…
Nineteen new fabs and lines are forecast to begin construction in 2016 and 2017, according to SEMI. Although fab equipment spending was down two percent in 2015, SEMI expects fab spending to grow by 1.5 percent in 2016, followed by an increase of 13 percent in 2017. Activity in the 3D NAND, 10-nm logic, and…
A continuing DRAM supply glut resulted in price declines of nearly 10 percent in October for average DRAM contract prices, reported DRAMeXchange, a division of TrendForce. The market researcher’s latest DRAM price report finds the average contract price of DDR3 4GB modules dropped from $18.50 in September to $16.75 in October with the lowest contract price…