Montreal, Canada – Future Electronics, a global leading distributor of electronic components, is pleased to announce its worldwide distribution agreement with Cypress Semiconductor Corp. has been extended to include Spansion products, following the merger of Cypress and Spansion. The merger of the two companies enables Future Electronics, a long time leading distributor for Cypress, to expand its…
Cypress Semiconductor Corp. (NASDAQ: CY) and Spansion, Inc. (NYSE: CODE) announced that they have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion. In a special meeting, Cypress shareholders approved the issuance of 2.457 shares of Cypress stock to Spansion shareholders for each Spansion share they own.…
Sunnyvale, Calif. — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and XMC, China’s fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements. According to TechNavio, 3D NAND is expected to grow at a…
The microcontroller (MCU) market is expected to show positive sales in 2015 thanks to a sharp recovery in smartcards, improvements in the global economy, and the emergence of new embedded-systems applications, such as wearable electronics and the Internet of Things (IoT), according to IC Insights’ 2015 edition of The McClean Report. These market factors, in addition…
Spansion Inc. (NYSE: CODE), a worldwide leader in non-volatile memory and embedded systems solutions, and Macronix International Co., Ltd. (TSE: 2337), a global leader in non-volatile memory semiconductor solutions, today announced the companies have settled all outstanding patent disputes and actions, including their respective complaints at the US International Trade Commission as well as District…
Sunnyvale, Calif. — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions and Sensoplex, a world leader in the design and production of high performance wearable devices for sports, fitness, wellness and mHealth companies, today announced a partnership to jointly develop and market an evaluation and development kit platform (EVK and SDK) that will…
Cypress Semiconductor Corp. (NASDAQ: CY) and Spansion, Inc. (NYSE: CODE) today announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion. The post-merger company will generate more than $2 billion in revenue annually and create a leading global provider of microcontrollers and specialized memories needed in today’s embedded systems.…
Sunnyvale, Calif. — Spansion Inc. has expanded its automotive-grade Serial NOR flash product line with the launch of the FL-S family in 128-Mb and 256-Mb densities. These devices are qualified for the extended temperature range of -40 degrees C to +125 degrees C. The added temperature offerings complement the existing serial flash memory portfolio, ranging from…
Sunnyvale, Calif. — Spansion Inc. has expanded its Traveo microcontroller (MCU) family aimed at human machine interfaces (HMI) in automotive dashboards. Spansion is integrating its HyperBus interface with its ARM Cortex-R5-based embedded Traveo MCU for the first time, enabling seamless connections with HyperBus memories, including Spansion HyperFlash memory, to simplify design and provide faster performance in…
Sunnyvale, Calif.– Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and Integrated Silicon Solution, Inc. (NASDAQ: ISSI), a leader in advanced memory solutions, today announced plans to develop HyperRAM™ products based on the Spansion HyperBus™ interface, which dramatically improves performance while reducing the number of pins. Both companies will have rights to sell…
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