TI Smart Meter SoCs Enable More Features

Dallas, Tex. – Texas Instruments (TI) has introduced three-phase metering systems-on-chip (SoCs) for smart electricity meters and portable measurement applications. The MSP430F67641 SoCs include high-performance delta-sigma analog-to-digital converters (ADCs) for energy measurement products requiring high accuracy across a wide dynamic range. An integrated 320-segment LCD eliminates the need for external drivers and enables developers to create smart energy measurement…

Altium Teams With TI on Design Tool

Altium Limited, a global leader in Smart System Design Automation, 3D PCB design (Altium Designer) and embedded software development (TASKING)) today introduced WEBENCH® Altium Connector, a collaborative effort between Altium and Texas Instruments (TI) to blend TI’s award-winning WEBENCH power design and simulation tools with Altium’s leading EDA tool suite Altium Designer. This powerful platform…

Avnet EM, TI Announce SAR ADC Design Webinar

WHAT: Avnet Electronics Marketing, a business region of Avnet, Inc. (NYSE: AVT), has collaborated with Texas Instruments (TI) to create a dynamic webinar that will help engineers overcome the biggest obstacle to achieving the desired results with precision SAR analog-to-digital converter (ADC) data acquisition circuits – the design of the ADC driver and reference circuitry. Technical experts…

Partnerships Aim to Drive IoT Designs

The growing connectivity in a variety of applications ranging from smart personal devices to automotive infotainment and navigation, driven by the Internet of Things (IoT), offers big potential opportunities for component vendors across a number of devices including microcontrollers, microprocessors, and sensors. IHS Technology expects the global market for connected, or Internet-enabled devices, to surpass 6…

TI Extends Small Packaging to MSP430 MCUs

Dallas, Tex. — Texas Instruments (TI) has expanded the availability of tiny package sizes to several new families of ultra-low-power MSP430 microcontrollers (MCUs). This enables the design of smaller products with TI’s ultra-low-power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in…

Element14 Lauds TE, TI

  element14 acknowledged TE Connectivity (TE) and Texas Instruments with two awards at Electronica China 2014. These awards recognised the outstanding commitment from both TE and Texas Instruments in their year-long collaboration on co-marketing activities with element14 throughout Asia-Pacific.   Jeff Uden, Vice President – Product and Supplier Marketing, element14 Asia-Pacific said, “The last year…

Tips For Thriving in a Flat IP&E Market

In some circumstances – political leadership, for example – long-term stability is a good thing. In the interconnect, passive and electromechanical (IP&E) market, a little upward or even downward momentum would be a welcome change for many companies in the electronics supply chain. “From the leadtime perspective, there has been very little change [from 2013],”…

TI Unveils First IoT-Capable LaunchPad

Austin, Tex. – Texas Instruments (TI) has extended its microcontroller (MCU) LaunchPad ecosystem with the introduction of the Tiva C Series Connected LaunchPad. Touted as the first Internet of Things (IoT) enabled LaunchPad, this evaluation tool platform enables engineers to prototype a wide range of cloud-enabled applications, bringing connectivity to any new or existing LaunchPad-based…