Samsung Begins Mass Production of Fastest DRAM

Seoul, Korea – Samsung Electronics Co., Ltd., announced today that it has begun mass producing the industry’s first 4-gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing (HPC), advanced graphics and network systems, as well as enterprise servers. Samsung’s new HBM solution will offer unprecedented…

Socionext Starts Volume Mfg of ‘Camera Front Engine’

Sunnyvale, Calif. — Socionext America Inc., a new leader in advanced custom SoC design technology, today announced volume production of its new MB86S29, a ‘camera front engine’ specialized for Bayer data processing that accommodates new functions of the industry’s latest image sensors. The MB86S29 is the newest Milbeaut Image Processor product from Socionext and is…

UMC Enters High Volume Touch IC Production

Hsinchu, Taiwan — United Microelectronics Corporation (NYSE:UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC’s 0.11um eFlash process. The specialized technology, first introduced by UMC in late 2012 as the foundry industry’s first, true 12-volt aluminum back-end-of-line (BEoL) process, is…

UMC Starts Volume Production for Lantiq PMICs

Hsinchu, Taiwan — United Microelectronics Corporation (NYSE: UMC; TSE: 2303) (“UMC”), a leading global semiconductor foundry, and Lantiq, a leading supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications. The SPT170 offers the industry’s highest breakdown…