Spansion, XMC to Jointly Develop 3D NAND

Sunnyvale, Calif. — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and XMC, China’s fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements. According to TechNavio, 3D NAND is expected to grow at a…