Lyon, France –– Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12”eq.wafers) in 2020, supported by the wider adoption of Cu pillar technology. That growth will be led by Moore’s law pushing beyond the 28nm node and ‘More than Moore’ evolution in next generation DDR and 3DICs.…
The compact camera module (CCM) market is forecast to double in the next five years, reaching $51 billion by 2020, driven by mobile phone and automotive sectors, according to a new report from Yole Développement. The report, Camera Module Industry, finds the mobile phone segment will grow from 72 percent to 74 percent of revenues…
Lyon, France – The insulated-gate bipolar transistor (IGBT) device market is forecast to reach $6.2 billion in 2020, growing at a compound annual growth rate (CAGR) of 10 percent between 2014 and 2020, bolstered by the electric vehicle market, according to Yole Développement (Yole). By 2020, Yole expects electric vehicles to account for 50 percent…
Lyon, France – After two years of stalled growth, the power semiconductor market grew 8.4 percent in 2014, reaching $11.5 billion, according to new research from Yole Développement (Yole). A key finding in the new report indicates that disruptive technologies such as silicon carbide (SiC) and gallium nitride (GaN) are now starting to generate revenue,…
Current memory technologies such as DDR, both the compute variety (DDR3 / DDR4); and the mobile variety, (LPDDR3/LPDDR4); are expected to reach the end of their road soon, according to market research firm Yole Développement. Thus several new DRAM memory architectures based on 3D layer stacking and through silicon via (TSV) have evolved to carry…
Sensors are a key component in driving the Internet of Things (IoT), which in turn will drive phenomenal growth in the electronics components market for the foreseeable future. Sensor technology continues to evolve, and sensors that measure more than one input—heat, light, liquid, motion etc.– on a single device are poised to soon overtake discrete…
Lyon, France – Last month, Yole Développement (Yole) announced the update of its technology and market analysis, LED Packaging Technology & Market Trends. Under this new report, the research market and strategy consulting company highlights the impact of advanced packaging technologies in the LED industry. “The combination of cost reduction and advanced packaging technologies such as Flip Chip and…
Lyon, France – 3D Through Silicon Vias (TSV) is in MEMS, CMOS Image Sensors and high-end applications. When will it be used for mainstream consumer applications? All results are part of the new report released by Yole Développement (Yole): 3DIC & 2.5D TSV Interconnect for Advanced Packaging – 2014 Business Update. This technology & market…
Market researchers forecast strong growth for the global microelectromechanical (MEMS) microphone market over the next several years, thanks in part to high quality audio requirements for handsets and tablets, the biggest consumers of the tiny devices. The biggest buyers of MEMS microphones are Apple and Samsung, according to IHS Technology, which forecasts the market to…