January 10, 2014 

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EDITOR'S NOTE:

  

Everyone knows the annual Consumer Electronics Show (CES) is all about showcasing the latest and greatest electronic gadgets. Sure 4K ultra HD (UHD) TVs are pretty amazing, and so are the curved TVs, as well as some of the wearable devices and tablets crammed with all kinds of functionality. But these devices wouldn't exist without the tiny components developed and manufactured by the most innovative component manufacturers in the industry. 

 

Component manufacturers leveraged the annual show to launch, demo or showcase some of their latest component designs, aimed at the consumer electronics market, ranging from wearable and handheld devices to satellite and smart TVs. Here's a sampling of some of the newest components for next-generation electronics devices unveiled by component suppliers at this year's show. 

 

First up are PNI Sensor's Motion & Measurement (M&M) modules for wearable fitness devices, smartphones, video game consoles and TV remote controls. The company claims these devices are the industry's first M&M modules. The integrated platform provides accurate motion and heading measurement for any of these applications.

  

TI showcased its streaming audio system solution for streaming audio in home and portable applications. This solution, comprised of the Sitara AM335x processors, WiLink 8 connectivity solution, power management IC, audio codec and Aureus high-performance audio processors, enables consumers to connect all their portable or home connected audio devices that support AirPlay and DLNA.

  

Conexant Systems unveiled its CX2092x high-performance far-field voice input processor SoC designed specifically for smart TVs. The company says the chip "uses third generation voice processing technology to deliver "superior voice control with excellent speech recognition hit rates and voice communications with increased clarity in far-field conditions - up to four meters away from the TV."

  

Another first of its kind comes from MEMSIC. The company claims its connected watch development kit is an industry first. This dev kit is said to simplify the integration of sensors by providing all of the required calibration libraries and sensor fusion software. The wearable connected watch development kit is designed for a variety of wearable consumer electronic applications with connectivity to Apple and Android platforms, including health and fitness and sports devices.

  

Toshiba America Electronic Components unveiled new enhancements to its TB6865FG power transmitter and TC7763WBG receiver chipset that enable wireless power transfer to charge mobile devices faster. The wireless power chipset now supports 5-watt power transfer, and is compatible with the Qi low-power specifications version 1.1 defined by the Wireless Power Consortium (WPC).

  

Also announced at CES 2014 is Bosch Sensortec's BME280 integrated environmental device that combines pressure, humidity, and temperature sensors in a single package. A major benefit for mobile devices such as smartphones, tablets, smart watches, and electronic wristbands is its small footprint of 2.5 x 2.5 mm2 with a height of 0.93 mm in an 8-pin LGA package. The BME280 also offers very low current consumption of 3.6 A (at 1 Hz), making it suitable for battery-driven applications.

  

Murata Americas took advantage of CES 2014 to launch its XRCGD series of quartz crystal resonators in a 2016 package size for wearable and handheld electronic devices. These devices are said to offer a cost advantage over other similar sized hermetically sealed packaging used today. The quartz crystal resonator line meets the strictest frequency tolerance requirements for Wi-Fi, Bluetooth, and radio frequency/baseband applications, said Murata.

  

MaxLinear used the show as a platform to announce that it has started shipping its MxL5xx family of Full-Spectrum Capture (FSC) tuner-demodulators for DVB-S/S2 satellite television systems. Designed for multi-channel gateways, the MxL5xx devices are touted as the first single-chip Full-Spectrum Capture satellite TV receiver ICs that support single or multiple RF inputs, up to a maximum of four. The six SoCs in the MxL5xx family of satellite front-end devices also integrate from four up to a maximum of eight DVB-S/S2 demodulators, which enables reception and demodulation of an equal number of digital satellite TV channels simultaneously.

 

Please scroll down for more detailed information about each of these products, and other significant products and component news over the past month.

  

Do you think I should have considered other products for this month's picks? Send me a note at gina.roos@epsnewsonline.com.

  

Best regards,

  

Gina

  

Gina Roos
Executive editor
Electronics Purchasing Strategies

 
HOT PRODUCTS 

PNI Sensor Unveils M&M Modules

PNI Sensor (PNI) has unveiled its Motion & Measurement (M&M) modules at the 2014 Consumer Electronics Show (CES). Claimed as the first M&M modules, the integrated platform provides accurate motion and heading measurement in wearable fitness devices, smartphones, video game consoles and TV remote controls.

 
Continue reading

TI Offers Streaming Audio Solution

Texas Instruments (TI) offers a comprehensive system solution for streaming audio in home or portable applications. The integrated and optimized solution is designed to help customers accelerate time to market for applications such as portable speakers, sound bars, audio video receivers (AVRs) and connectivity modules that enable OEMs to add connectivity to any set of speakers.

 
Continue reading

Conexant Debuts Voice Processor for Smart TVs

Conexant Systems Inc. unveiled its CX2092x high-performance far-field voice input processor system-on-chip (SoC) designed specifically for smart TVs. The chip uses third generation voice processing technology to deliver "superior voice control with excellent speech recognition hit rates and voice communications with increased clarity in far-field conditions - up to four meters away from the TV," according to Conexant.  Continue reading

  


MEMSIC Offers Wearable Watch Dev Kit

MEMSIC, Inc. announced at the 2014 Consumer Electronics Show (CES) a wearable connected watch development kit for a variety of wearable consumer electronic applications with connectivity to Apple and Android platforms, including health and fitness and sports devices. The microelectromechanical systems (MEMS) sensor manufacturer claims the MMW-SDK is the first of its kind connected watch development kit, which simplifies the integration of sensors by providing all of the required calibration libraries and sensor fusion software. Continue reading


Toshiba Enhances Chipset for Fast Wireless Charging

Toshiba America Electronic Components, Inc. (TAEC) unveiled new enhancements to its TB6865FG power transmitter and TC7763WBG receiver chipset that enable wireless power transfer to charge mobile devices faster. The wireless power chipset now supports 5-watt power transfer, and is compatible with the Qi low-power specifications version 1.1 defined by the Wireless Power Consortium (WPC), including rigorous Foreign Object Detection (FOD). The chipset also integrates digital controller logic that reduces component count and minimizes design complexity, said TAEC.   Continue reading


 
Bosch Sensor Combines Multiple Functions

Bosch Sensortec announced the introduction of the BME280 integrated environmental unit at the Consumer Electronics Show (CES) 2014. Touted as the industry's first integrated environmental unit, the BME280 device combines sensors for pressure, humidity and temperature in a single package. Applications include indoor navigation, home automation control, personalized weather stations, and sport and fitness applications. A benefit for mobile devices such as smartphones, tablets, smart watches, and electronic wristbands is its small footprint of 2.5 x 2.5 mm2 with a height of 0.93 mm in an 8-pin LGA package.  Continue reading

 


Murata Packages Crystal Resonator in 2016 Size   
 

Murata Americas launched its XRCGD series of quartz crystal resonators at the 2014 Consumer Electronics Show (CES). The quartz crystal resonator line meets the strictest frequency tolerance requirements for Wi-Fi, Bluetooth, and radio frequency/baseband applications, said Murata. The XRCGD series extends the company's Hybrid Crystal Resonator (HCR) line-up to deliver a hermetically sealed solution in a 2016 package without a cost penalty.   Continue reading

MaxLinear Delivers Full-Spectrum Capture Satellite TV Receiver ICs

MaxLinear Inc. has announced at the 2014 Consumer Electronics Show (CES) that it has started shipping its MxL5xx family of Full-Spectrum Capture (FSC) tuner-demodulators for DVB-S/S2 satellite television systems. Designed for multi-channel gateways, the MxL5xx devices are touted as the first single-chip Full-Spectrum Capture satellite TV receiver ICs that support single or multiple RF inputs, up to a maximum of four.  Continue reading

 


New Products 
Component News 

Micron: Memory IC Outlook 'Very Favorable'

Micron Technology Inc. (NASDAQ: MU) is starting 2014 with a boatload of good news for shareholders in terms of its latest financial performance and outlook for the year ahead. The semiconductor manufacturer's recent quarter results trumped analysts' average estimates with sales more than doubling year-over-year and gross profit margins surging 7 percentage points sequentially, an extraordinary performance for a company that's still midway through the integration of a major acquisition and several other strategic but potentially disruptive programs. 

 Continue reading

 

Xilinx Holds Tightly to FPGA Lead

Xilinx Inc. (NASDAQ: XLNX) is hot with investors and the analyst community. The rating of the semiconductor manufacturer was recently upgraded by several research firms with all of them jacking up their 52-week price target for its stock on the belief that the company is well positioned for near-term growth after notching a technology edge against its closest rivals.  Continue reading

 

Stable Lead Times Ahead for Aluminum Caps

Lead times of aluminum electrolytic capacitors are expected to remain stable in the 12- to 16-week range. However, lead times may extend out as far as 32 weeks (including six weeks for delivery) for some types, according to Avnet's December Market & Technology Trends report. The distributor also reported that standard lead times for these capacitors typically range between 12 to 14 weeks. Continue reading 


Suppliers Eye IoT

Is the Internet of things (IoT) the next big thing? Clearly, it's on the radar screen for many players in the electronic components industry. And it should be based on some of the projected market size numbers from market research providers. Gartner, for example, identifies IoT as one of the top 10 tech trends for 2014, and pegs the market size at 26 billion units installed in 2020, up from 0.9 billion in 2009. Frost & Sullivan also believes that there will be an "explosion of IoT activity" over the next few years driven by low-cost sensors. Continue reading

 

Component Trends: Movement in Leadtimes & Pricing

There's been a little movement in component lead times and prices since the end of the third quarter, according to Avnet Electronics Marketing's Market & Technology Trends report for the month of December. In discrete semiconductors, logic and memory products, leadtimes are beginning to stretch and prices are inching up from the prior month. Continue reading

 

Intel to Buy Mindspeed's Wireless Assets


Avago to Purchase LSI for $6.6B

  

Littelfuse Acquires SymCom


Flexible Displays Debut at CES


Immersion Launches Automotive Haptics Portal


SOLiD Joins Panduit Partnership

 

Murata & Sensor Platforms Team Up

 

Rambus Inks Pact With Samsung

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